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Friday, May 16, 2008 
 
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  • Control exhaust in each step of your process
  • Create the ideal atmosphere for thin film uniformity then repeat time after time
  • Retrofits to nearly all Laurell spin processors

  • Some processes (particularly thin coatings) are very sensitive to even the smallest gas flow within the process chamber.

  • You can now automatically control the application of exhaust as part of a process

  • It is now possible to create a static or reduced flow condition then fully exhaust vapors before opening the process chamber

  • On some systems the process chamber can also be locked to further insure an absolutely repeatable process every time


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