This advanced research and development tool is flexible, safe and affordable. The EDC series is typically employed for both solvent and aqueous-based processing: Etch-Rinse-Dry, Develop-Rinse-Dry, as well as solvent and aqueous cleaning. The spin processor features a zero-porosity Teflon® fluid path with an onboard dispense valve manifold. A clear ECTFE dome-shaped lid allows safe visibility of your process as it runs, even during single-step process development mode (an exclusive Laurell capability).

The EDC system (shown) features programmable valves leading to single injector chemical dispense for repeatability required for Etch, Develop, and Cleaning applications where a rinse (typically DI water or solvent) then dry (typically N₂) are the final process steps. With this sequential valving technique the wafer and plumbing begin and end the process completely dry. Isolated and independent injectors are available in static positions yet adjustable within the lid. Optional dynamic linear or dynamic radial dispensing is also within the systems attributes. Although a non-vacuum chuck is always recommended for these processes the system has a vacuum hold-down capability as well.

Redundant Protection is provided by a door latch, a door lock and an electrical interlock, while an edge-grip or vacuum style chuck supports substrates A large drain and exhaust port are also included.

General Features:

• Models available for 150, 200 and 300 mm wafers and square substrates
  
• Digital Process Controller
  
• Solid Natural Polypropylene or Teflon® housing with interlocking clamshell plenum
  
• Clear ECTFE domed lid
  
• Teflon® control valves / UD-1b injectors (converts quickly and easily from a pump, to a pressure vessel or a syringe)
  
• Adjustable process N₂ diffuser with bowl wash
  
• Adjustable down-flow exhaust and drain (includes 10' of flexible duct)
  
• Electrically double insulated & overload protected
  
• Safety door interlock (disallows rotation and chemical dispense process chamber is open)
  
• Safety door latch (requires deliberate action to open the process chamber)
  
• Safety door lock (process chamber can not be opened while a program is running or during chuck rotation after program ends)